Moiré strain analysis of paper
نویسنده
چکیده
منابع مشابه
Automatic Full Strain Field Moiré Interferometry Measurement with Nano-scale Resolution
Moiré Interferometry (MI) theoretically can provide real-time full strain field measurements in dynamic environment. So it’s extensively used in reliability analysis of electronic packaging. Due to the nature of specimen preparations procedure, the optical noise is usually too strong so that an accurate phase-based information processing is not possible. In this paper, a 164 nm/pixel spatial re...
متن کاملMoiré methods for the protection of documents and products: A short survey
Moiré effects have long been used for various applications in many different fields, including metrology, strain analysis, optical alignment, etc. In the present survey we describe some of the main applications of the moiré effect in the field of document and product security. We review the main families of moiré-based anticounterfeiting methods, compare them, and explain how they can be used f...
متن کاملThermal strain analysis of an electronics package using the SEM Moiré technique
This paper reports on a study of the scanning electron microscope (SEM) Moiré method. Tests were carried out by rotating the specimen grating slightly with respect to the electron scanning raster lines, to verify that the Moiré images captured were really due to the interference between specimen and reference gratings. The experimental results coincided well with the calculated theoretical valu...
متن کاملAN INVESTIGATION OF BGA ELECTRONIC PACKAGING USING MOIRÉ INTERFEROMETRY by NORMAN RIVERS A thesis submitted in partial fulfillment of the requirements for the degree of Master of Science in Mechanical Engineering
As technology progresses towards smaller electronic packages, thermomechanical considerations pose a challenge to package designers. One area of difficulty is the ability to predict the fatigue life of the solder connections. To do this one must be able to accurately model the thermo-mechanical performance of the electronic package. As the solder ball size decreases, it becomes difficult to det...
متن کاملMeasurement of Thermally Induced Warpage of BGA Packages/Substrates Using Phase-Stepping Shadow Moiré
Phase-stepping technique is applied to the analysis of fringe pattern images of BGAs (Ball Grid Arrays) obtained by shadow moiré. Sensitivity of the fringe pattern analysis is demonstrated to be significantly increased. Thermally induced warpage of BGAs is successfully measured in real-time as the sample is driven through a simulated reflow process. The paper discusses the technique of phase st...
متن کامل